| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component mounting device capable of coping with warpages of a printed board, in as short a measurement time as possible, when there are two mounting stages. <P>SOLUTION: A height of a printed board P of a mounting stage 5A1 at a plurality of positions is detected with a height-detecting device 12. After an electronic component is mounted by the mounting stage 5A1, only the height at an arbitrary position among the plurality of ones is detected. A CPU compares second measurement results with first measurement results, corresponding to them. If all the second measurement results are decided as being within a specified range of the first measurement results corresponding to them, the CPU controls the lowering of a suction nozzle, by utilizing the first measured result, when an electronic component is mounted on the printed board P at a second mounting stage 5A2. <P>COPYRIGHT: (C)2008,JPO&INPIT |
