| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package and a module printed circuit board for mounting the package. SOLUTION: This invention includes a substrate, a first-type of pad structure formed on a first region of the substrate, and a second-type of pad structure formed on a second region of the substrate. The first-type of pad structure includes a first conductive pad formed on the substrate; and a first insulation film which is applied on the substrate, has an opening that exposes the sidewall of the first conductive pad locally, and covers the first conductive pad partially. The second-type of pad structure includes a second insulation film which is applied on the substrate and has a second opening; and a second conductive pad which is formed on the substrate within the second opening and whose sidewall is exposed. According to such a structure, by adopting a structure which excels in reliability with respect to physical stresses and thermal stresses, reliability with respect to stresses applied to the semiconductor package and the module printed circuit board 100 can be enhanced. COPYRIGHT: (C)2008,JPO&INPIT |
