| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing an aluminum water-cooling heat sink for soldering a DBA substrate without nickel plating after vacuum brazing or a method for manufacturing an aluminum water-cooling heat sink provided with the DBA substrate for realizing direct soldering of an electronic component to the surface of the heat-sink. SOLUTION: An aluminum clad material 4 is arranged to the external surface of the heat-sink body 1 via a brazing material 3 and an assembly thereof is integrated with the vacuum brazing process. An Fe or Ni layer is arranged on the Al layer as a clad material 4. COPYRIGHT: (C)2008,JPO&INPIT
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