| 发明名称 |
PRINTED ELECTRONIC COMPONENTS ON UNIVERSALLY PATTERNED SUBSTRATE FOR INTEGRATED PRINTED ELECTRONICS |
| 摘要 |
A circuit can include a pre-patterned substrate having a supporting material, multiple segments thereon, and interdigitated line structures within each segment. Some of the line structures can be bundled together, and an electrical component can be formed by ink jetting onto the bundled line structures. |
| 申请公布号 |
US2016174384(A1) |
申请公布日期 |
2016.06.16 |
| 申请号 |
US201414568620 |
申请日期 |
2014.12.12 |
| 申请人 |
Palo Alto Research Center Incorporated |
发明人 |
Mei Ping;Ng Tse Nga;Whiting Gregory |
| 分类号 |
H05K3/12;H05K1/18;H05K1/09 |
主分类号 |
H05K3/12 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A circuit, comprising:
a pre-patterned substrate, the pre-patterned substrate including:
a supporting material;a plurality of segments on the supporting material; anda plurality of interdigitated line structures within each segment, wherein some of the interdigitated line structures are bundled together; and at least one electrical component formed by ink jetting onto the bundled line structures. |
| 地址 |
Palo Alto CA US |
