| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve manufacturing efficiency of a semiconductor device and reduce manufacturing cost by facilitating position detection of a semiconductor substrate having a supporting substrate formed thereon. <P>SOLUTION: The semiconductor substrate 1 having a first notch 7 is stuck on the supporting substrate having a second notch 8 so that the first notch 7 may overlap on the second notch 8. A surface 1b opposite to a surface 1a opposite to the supporting substrate 2 of the semiconductor substrate 1 in which the supporting substrate 2 is stuck is processed, and the semiconductor substrate 1 is thinned to a predetermined thickness. In addition, a film forming process is executed for the processed surface 1b of the semiconductor substrate 1 as necessary. <P>COPYRIGHT: (C)2009,JPO&INPIT |
