| 摘要 |
A sealing ring (24) for attaching to a cover ring (16) of a wafer treating device (10) has an annular carrier (40) and a sealing lip (42) releasably attached to the carrier. The wafer treating device has a receptacle (12) for a wafer (14), the cover ring placed onto the receptacle, and the sealing ring to seal the wafer on the receptacle. In a method for producing the sealing ring, the carrier is provided on its upper side with a groove (50) and a bearing surface which slopes radially inwardly. The sealing lip is provided with a bead (52). The diameter of the bead in the initial state of the sealing lip is smaller than the diameter of the groove. The sealing lip is fitted in the groove to extend along the bearing surface and its free end extends beyond the lower side of the carrier. |
