| 发明名称 |
METHOD OF INTIMATELY BONDING THERMOPLASTICS |
| 摘要 |
A process for intimately bonding a conducting or semiconducting thermoplastic layer to a non-conducting thermoplastic substrate. The bond achieved between the two thermoplastic layers is devoid of gas and is particularly adaptable to high voltage insulation and capacitor applications.
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| 申请公布号 |
US3769132(A) |
申请公布日期 |
1973.10.30 |
| 申请号 |
USD3769132 |
申请日期 |
1969.11.06 |
| 申请人 |
HIGH VOLTAGE ENG CORP,US |
发明人 |
CRAM R,US |
| 分类号 |
B29C65/00;B29C65/18;H01G13/00;(IPC1-7):B29C27/14 |
主分类号 |
B29C65/00 |
| 代理机构 |
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| 地址 |
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