| 摘要 |
PROBLEM TO BE SOLVED: To provide a modified polycarbodiimide compound which can cure a resin composition at relatively low temperatures and can suppress curing the resin composition in a dry step before the thermosetting step of the resin composition; a curing agent containing the modified polycarbodiimide compound; and a thermosetting resin composition containing the curing agent.SOLUTION: A modified polycarbodiimide compound is obtained by modifying a diisocyanate compound-derived polycarbodiimide compound which is at least one aliphatic amine selected from the group consisting of diethylamine, methyl isopropylamine, tert-buthylethylamine, di-sec-butylamine, dicyclohexylamine, 2-methylpiperidine and 2,6-dimethylpiperidine. A curing agent contains the modified polycarbodiimide compound. A thermosetting resin composition contains a carboxyl group-containing resin having a carboxyl group in the molecule or an epoxy resin having two or more epoxy groups in one molecule, and a curing agent.SELECTED DRAWING: None |
