| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead frame for optical semiconductor device which maintains various functions in an optical semiconductor device, reduces noble metal plating to be used for the lead frame and can be produced by a cost-reduced manufacturing method, a lead frame with resin, the optical semiconductor device and the manufacturing method of the lead frame for optical semiconductor device.SOLUTION: The lead frame for optical semiconductor device is used for the optical semiconductor device and the lead frame with resin for optical semiconductor device and comprises: a die pad part on which an LED element can be mounted; a lead part which is disposed around the die pad part and can be electrically conducted with the LED element via a connection member; and plating layers on surfaces of the die pad part and the lead part on which the LED element is mounted, and opposite surfaces. At least, thickness of the plating layers applied to a first region including a mounting region of the LED element in the die pad part and a second region including a connected region of the lead part is greater than thickness of the plating layer applied to the surface at a side opposite to the surface on which the LED element is mounted, in the die pad part.SELECTED DRAWING: Figure 1 |
