发明名称 |
COMPOUND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a compound semiconductor device and a method of manufacturing the same capable of suppressing a leakage current even when a high voltage is applied to a drain electrode.SOLUTION: A compound semiconductor device includes: a substrate 101; a nucleation layer 102 provided above the substrate 101; a first buffer layer 104 provided above the nucleation layer 102; a second buffer layer 103 provided between the nucleation layer 102 and the first buffer layer 104, and that includes an acceptor impurity element or a donor impurity element at a higher concentration than the first buffer layer 104; a carrier transit layer 105 provided so as to be contacted with the first buffer layer 104; a carrier supply layer 106 provided above the carrier transit layer 105; and a gate electrode 111, a source electrode 112 and a drain electrode 113 provided above the carrier supply layer 106.SELECTED DRAWING: Figure 1 |
申请公布号 |
JP2016207818(A) |
申请公布日期 |
2016.12.08 |
申请号 |
JP20150087119 |
申请日期 |
2015.04.21 |
申请人 |
FUJITSU LTD |
发明人 |
NISHIMORI MICHIHITO;IMADA TADAHIRO;CHU RYOI |
分类号 |
H01L21/338;H01L21/205;H01L21/336;H01L29/778;H01L29/78;H01L29/812;H02M3/155;H02M3/28;H02M7/12 |
主分类号 |
H01L21/338 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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