| 摘要 |
This invention relates to a method and an arrangement of mounting semiconductor elements on heat sinks. The switching element is glued inseparably to an intermediate layer consisting of cleavable material. One side of the intermediate layer is glued inseparably to the heat sink. If a defective switching element has to be replaced, a moderate impact on the mounting plate of the element in parallel to the surface of the heat sink is sufficient to cause an exact cleavage.
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