发明名称 Method for processing a substrate and apparatus for performing the same
摘要 A method for processing a substrate includes arranging the substrate on which a photoresist layer is formed and providing a treatment liquid for removing the photoresist layer on the substrate. The method also includes providing a mist including deionized water or hydrogen peroxide on the substrate to make contact with the treatment liquid so as to increase a temperature of the treatment liquid. Therefore, efficiency of removing the photoresist layer may be improved.
申请公布号 US9529267(B2) 申请公布日期 2016.12.27
申请号 US201313928446 申请日期 2013.06.27
申请人 Semes Co., Ltd. 发明人 Rho Eun-Su;Bae Jeong-Yong
分类号 B08B3/00;G03F7/42;H01L21/67 主分类号 B08B3/00
代理机构 Daly, Crowley, Mofford & Durkee, LLP 代理人 Daly, Crowley, Mofford & Durkee, LLP
主权项 1. A method for processing a substrate, the method comprising: arranging the substrate on which a photoresist layer is formed; providing a treatment liquid for removing the photoresist layer on the substrate; and providing a mist including deionized water or hydrogen peroxide on the substrate to make contact with the treatment liquid such that the mist and the treatment liquid react with each other so as to increase a temperature of the treatment liquid, and to generate a radical hydroxide which reacts with the photoresist layer to substantially remove the photoresist layer from the substrate, wherein the treatment liquid and the mist make contact with each other before provided on the substrate.
地址 KR