| 摘要 |
<p>1373008 Integrated circuit assemblies HONEYWELL INFORMATION SYSTEMS ITALIA SpA 11 Nov 1971 [17 Nov 1970] 52519/71 Heading H1K Peripheral contact pads on integrated circuit chips are connected to sets of terminals disposed about chip mounting sites on an insulating substrate with the aid of an auxiliary support which has apertures corresponding to the site locations and bears on one face sets of conductive leads which are cantilevered into the apertures so that their inner ends line up with the pads on the chips. As described the chips, formed by scribing or etching from a common wafer, are held in the positions in which they are formed by having been dipped in a hardening but non-adherent fluid. The auxiliary support is located with one set of leads engaging the pads of one chip to which they are simultaneously soldered by ultrasonic or thermocompression bonding. This process is repeated to attach the pads of other chips to other sets of leads. After electrically testing the chips the support is laid over a ceramic substrate carrying two mutually insulated layers of conductors formed by electrolytic and serigraphic techniques, with the leads overlying corresponding terminals about each mounting site. The terminal pads may be built up by electroplating to be coplanar with the pads or the chips or the substrate recessed at chip sites to the same end. After bonding to the terminals the leads are severed outward of the terminals and the auxiliary support removed. The support is an apertured plastics sheet stuck to an aluminium foil from which the leads are photoengraved. If the plastics is photo-sensitive it may be apertured after attaching to the foil.</p> |
