发明名称 Wound cleansing apparatus with stress
摘要 An apparatus for cleansing wounds with means for stressing the wound bed and optionally tissue surrounding the wound, in which irrigant fluid from a reservoir connected to a conformable wound dressing and wound exudate from the dressing are recirculated by a device for moving fluid through a flow path which passes through the dressing and a means for fluid cleansing and back to the dressing. The cleansing means (which may be a single-phase, e.g. micro-filtration, system or a two-phase, e.g. dialytic system) removes materials deleterious to wound healing, and the cleansed fluid, still containing materials that are beneficial in promoting wound healing, is returned to the wound bed. The means for stressing the wound bed and optionally tissue surrounding the wound promotes wound healing. The dressing and a method of treatment using the apparatus.
申请公布号 US9452244(B2) 申请公布日期 2016.09.27
申请号 US201012832002 申请日期 2010.07.07
申请人 SMITH & NEPHEW PLC 发明人 Blott Patrick Lewis;Greener Bryan;Hartwell Edward Yerbury;Walker Tina Michelle;Lee-Webb Julian;Nicolini Derek;Green Clare;Martin Robin Paul
分类号 A61M35/00;A61M1/00;A61F13/02;A61F13/00 主分类号 A61M35/00
代理机构 Knobbe, Martens, Olson & Bear, LLP 代理人 Knobbe, Martens, Olson & Bear, LLP
主权项 1. A method of treating a wound, comprising: applying a cyclically varying negative pressure to the wound in accordance with a sinusoidal waveform that varies relative to a baseline pressure, wherein the wound is covered at least partially by a conformable wound dressing configured to form at least a relatively fluid tight seal around at least a portion of the wound, wherein applying the cyclically varying negative pressure to the wound in accordance with the sinusoidal waveform comprises varying the sinusoidal waveform to include first and second maximum amplitudes of negative pressure, the first maximum amplitude different from the second maximum amplitude, wherein the cyclically varying negative pressure applied to the wound is below atmospheric pressure.
地址 London GB