发明名称 Contacting strips for electrodes of integrated circuit module - uses tongue shaped connector stamping with elasticised sections near proposed joints
摘要 A system for connecting the electrodes of integrated circuit modules using tongue contact strips made to the pattern of the layout. A relatively thick metal stamping is etched near the ends of the proposed joints leaving thin elasticised easily deformable strips which are later bonded with the electrodes of the semiconductor elements. The contact stamping is prepared by using a first masking technique reducing the sections of the proposed joints to thin membranes. A second masking process is then applied to these sections to produce shapes complementary to the electrode surfaces. After preparation the surface to be bonded is coated with a gold layer.
申请公布号 DE2003423(B2) 申请公布日期 1975.04.03
申请号 DE19702003423 申请日期 1970.01.27
申请人 LICENTIA PATENT-VERWALTUNGS-GMBH, 6000 FRANKFURT 发明人 KIELWEIN, FRITZ, 7107 NECKARSULM
分类号 H01L23/495 主分类号 H01L23/495
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