| 摘要 |
A cutting wheel for dicing semiconductor wafers having a thin cutting disc consisting of abrasive particles in a metal matrix bonded to a flange preformed on a hub and having a diameter larger than that of a flange, the hub having a shoulder extending axially from the flange, a flexible protective washer having a diameter greater than that of the cutting disc is fitted snugly on the hub and in close proximity to the cutting disc.
|
