发明名称 FILM CIRCUIT ASSEMBLIES
摘要 1397181 Component assemblies LUCAS ELECTRICAL CO Ltd 29 Nov 1973 [16 Jan 1973] 2240/73 Heading H1B A film circuit 11 is enclosed by supporting it, by means of a layer of silicone grease or the like, on a plate 10 of material of thermal conductivity adequate to act as a heat sink and covering it with cap 14 having apertures 18 through which leads 17 are led out and an aperture 20 for injecting synthetic resin material to protect the circuit. Circuit 11 may be located between projections 13. Leads 17 may be of resilient material, e.g. silver plated spring steel and as shown one end of a C-shaped portion thereof bears on the circuit and the other is located between parallel ribs 19 between which slots 18 are located.
申请公布号 GB1397181(A) 申请公布日期 1975.06.11
申请号 GB19730002240 申请日期 1973.01.16
申请人 LUCAS ELECTRICAL CO LTD 发明人
分类号 H05K5/00;H01L23/02;H01L23/28;H01L49/02;H05K7/14;(IPC1-7):05K7/00 主分类号 H05K5/00
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