Heat sink for printed circuit board - has liquid filled container with corrugated heat transfer wall

摘要

A sealed recipient contains a low boiling point liquid and in the interior of this is mounted the integrated circuit support which is adjacent to a corrugated wall of the recipient which is cooled by an external liquid. The corrugations have a depth appreciably greater than their distance apart. The integrated circuit support is mounted in the recipient so that its two faces are in contact with the low boiling point liquid. The support is held close to a wall which has sealed passages for the conductors soldered to the terminals of the printed circuit.