| 摘要 |
An Electroless plating bath, and processes for the autocatalytic deposition of Group IB metals upon various substrates using such a bath, are disclosed. The electroless plating bath disclosed includes an aqueous solution of an imide complex of the Group IB metal to be plated, an alkali metal cyanide, and a reducing agent, and is maintained at a pH of from about 11 to 14 by the addition of alkali metal hydroxides. In a preferred embodiment, an electroless gold plating bath is disclosed, including an aqueous solution of an alkali metal gold imide complex.
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