Process for the production of layer circuits with conductive layers on both sides of a ceramic substrate

摘要

Process for the production of layer-type printed circuits having conductive layers on both sides of a ceramic substrate in which an aperture is provided in a green (unfired) ceramic substrate, a high melting point pin is inserted into the aperture and thereafter the green substrate is sintered to bond the pin in place and provide for electrical connection between the two layers. A multi-layer composite can be made up by stacking a plurality of such substrates together with pins being provided to lock the substrates together and the entire multi-layer body is then sintered.