发明名称 Diffusion bonding of gold to gold
摘要 Low temperature diffusion bonds of gold to gold in which the bond tensile strength exceeds the yield point of gold, made by wetting the bonding surfaces with mercury and clamping the wetted surfaces together with moderate pressure, at a temperature of 100 DEG C for a period of 22-30 days.
申请公布号 US3923231(A) 申请公布日期 1975.12.02
申请号 US19750567230 申请日期 1975.04.11
申请人 THE UNITED STATES OF AMERICA AS REPRESENTED BY THE ENERGY RESEARCH AND DEVELOPMENT ADMINISTRATION 发明人 CATALANO, EDWARD;ORNELLAS, DONALD L.
分类号 B23K20/233;B23K35/00;(IPC1-7):B23K19/00 主分类号 B23K20/233
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