| 摘要 |
PROBLEM TO BE SOLVED: To provide a film-shaped adhesive usable for fixing the base material to be ground such as a silicone wafer to a supporting body, capable of easily being peeled even if there is no application of release components, and having sufficient heat resistance to withstand a high temperature of approximately 200°C.SOLUTION: Provided is a film-shaped adhesive containing thermosetting components. The film-shaped adhesive is cured in a state of being pasted on a glass sheet by heating in the order of at 130°C for 30 min, at 170°C for 30 min and at 200°C for 30 min, and, thereafter, upon the irradiation of light of 1,000 mJ/cm, the 30° peeling strength to the glass sheet of the film-shaped adhesive is 100 N/m or more after the curing of the film-shaped adhesive and before the irradiation of the light, and is 50 N/m or lower after the film-shaped adhesive is irradiated with the light.SELECTED DRAWING: None |
