发明名称 LASER CUTTING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a laser cutting device capable of suppressing a temperature rise of a nozzle.SOLUTION: A laser cutting device comprises: an optical system for supplying a laser beam from a laser source; a lens barrel for holding the optical system; and a laser beam emitting part through which the laser beam passing the optical system is emitted. The laser cutting device further comprises: a nozzle emitting the laser beam in a state of facing an object to be cut; and a cooling member which has a first channel through which coolant supplied from a liquid supply device flows and cools the nozzle.SELECTED DRAWING: Figure 4
申请公布号 JP2016215251(A) 申请公布日期 2016.12.22
申请号 JP20150104829 申请日期 2015.05.22
申请人 MITSUBISHI HEAVY IND LTD 发明人 KUREYA MASAYUKI;WATANABE MASANARI;UENO DAIJI;YOSHIOKA ATSUSHI;TSURUGA SHIGENORI;YAMANISHI YOSHIMI
分类号 B23K26/064;B23K26/00;B23K26/38 主分类号 B23K26/064
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