发明名称 |
LASER CUTTING DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a laser cutting device capable of suppressing a temperature rise of a nozzle.SOLUTION: A laser cutting device comprises: an optical system for supplying a laser beam from a laser source; a lens barrel for holding the optical system; and a laser beam emitting part through which the laser beam passing the optical system is emitted. The laser cutting device further comprises: a nozzle emitting the laser beam in a state of facing an object to be cut; and a cooling member which has a first channel through which coolant supplied from a liquid supply device flows and cools the nozzle.SELECTED DRAWING: Figure 4 |
申请公布号 |
JP2016215251(A) |
申请公布日期 |
2016.12.22 |
申请号 |
JP20150104829 |
申请日期 |
2015.05.22 |
申请人 |
MITSUBISHI HEAVY IND LTD |
发明人 |
KUREYA MASAYUKI;WATANABE MASANARI;UENO DAIJI;YOSHIOKA ATSUSHI;TSURUGA SHIGENORI;YAMANISHI YOSHIMI |
分类号 |
B23K26/064;B23K26/00;B23K26/38 |
主分类号 |
B23K26/064 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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