发明名称 LOW VOLTAGE BREAKING PN JUNCTION STRUCTURE
摘要 A structure and process are disclosed for making a low-voltage breakdown p-n junction in a semiconductor substrate. The process comprises the step of etching a V-shaped groove in a semiconductor substrate of a first conductivity type, with an anistropic etchant, followed by depositing a layer of epitaxial semiconductor material of a second conductivity type in the V-shaped groove. There results a p-n junction with a small radius of curvature at the apex of the V-shaped groove having a correspondingly low breakdown voltage.
申请公布号 JPS52130291(A) 申请公布日期 1977.11.01
申请号 JP19770039585 申请日期 1977.04.08
申请人 IBM 发明人 DEBITSUDO II DEEBAA;FURANSHISUKO EICHI DERAMONEDA
分类号 H01L29/78;H01L21/20;H01L21/306;H01L27/02;H01L29/06;H01L29/866 主分类号 H01L29/78
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