Arrangement of a heat sink and heat-generating electronic components housed thereon

摘要

An arrangement of a heat sink and a heat-generating electronic component is provided. The heat sink has a main part and a moulding of plastic. The electronic component is mounted on a first surface of the main part with thermal contact to the main part. The moulding is mounted to a second surface of the main part, opposite the first surface, to provide structural strength to the arrangement. The moulding has a void provided through the moulding. As a result, once the moulding and the main part are mounted to each other, a portion of the second surface of the main part is exposed through the void.

主权项

1. An arrangement comprising a heat sink and a heat-generating electronic component mounted to the heat sink,
wherein the heat sink comprises a main part and a moulding of plastic; wherein the main part comprises a first surface and an opposite second surface; wherein the electronic component is mounted to the first surface to allow heat generated by the electronic component to dissipate through the main part; wherein the moulding comprises a first fitting interface and the main part comprises a second fitting interface provided on the second surface of the main part, wherein the moulding is mounted to the main part through engagement of the first fitting interface and the second fitting interface to provide structural strength to the arrangement; and wherein the moulding comprises at least one void provided through the moulding, such that at least a portion of the second surface of the main part is exposed through the void after the moulding and the main part are mounted to each other, wherein the first fitting interface comprises a first perforation and the second fitting interface comprises a second perforation and wherein a fastener is provided to extend through the first perforation and the second perforation to engage the first fitting interface and the second fitting interface.