| 摘要 |
PROBLEM TO BE SOLVED: To make a device configuration compact in a member for a semiconductor manufacturing device including a plurality of RF terminals.SOLUTION: A ceramic heater 10 comprises a ceramic plate 12, a ceramic shaft 20, an RF base rod 22, and an RF terminal 30. The ceramic plate 12 is embedded with an RF electrode 16. A disc-like tablet 18 is electrically connected to two positions near the center of the RF electrode 16. The RF base rod 22 includes a socket 24 having two insertion holes 26. One end of the RF terminal 30 is joined to a tablet 18 of the RF electrode 16 via a brazing joint layer 32. The other end of the RF terminal is inserted into the insertion hole 26 of the socket 24. The high-frequency power of an RF power supply 40 is distributed from one RF base rod 22 to two RF terminals 30 via the socket 24, and supplied to the RF electrode 16.SELECTED DRAWING: Figure 1 |
