发明名称 LASER PROCESSING METHOD AND LASER PROCESSING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a laser processing method capable of achieving high quality laser processing without crack while maintaining positional accuracy.SOLUTION: A laser processing method comprises: a step for coating a surface of a glass substrate 11 which is a workpiece with a hydrophilic film 21 as a cooling coat; and a step for transporting the glass substrate 11 coated with the hydrophilic film 21 at constant speed, scanning laser beam by a galvano-scanner by cooperative control, radiating laser beam to the glass substrate 11 through the hydrophilic film 21, then forming a penetration hole 12 on an area where the laser beam is radiated.SELECTED DRAWING: Figure 4
申请公布号 JP2016215245(A) 申请公布日期 2016.12.22
申请号 JP20150103929 申请日期 2015.05.21
申请人 MITSUBISHI ELECTRIC CORP 发明人 MOTOKI YUTAKA
分类号 B23K26/382;B23K26/04;B23K26/08;B23K26/082;B23K26/146;B23K26/364;C03B33/09 主分类号 B23K26/382
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