PROCEDE DE REALISATION D'UN DISPOSITIF A EFFET DE CHAMP AMELIORE.

摘要

A SOI substrate is covered by a semiconductor material pattern which comprises a dividing pattern made from electrically insulating material. The dividing pattern is coated by one or more semiconductor materials. The semiconductor material pattern is covered by a gate electrode which faces the dividing pattern. The semiconductor material pattern and the gate pattern are covered by a covering layer. The substrate is eliminated to access the source/drain regions. A second covering layer is deposited and access vias are formed to access the source/drain regions and gate electrode.