| 发明名称 |
ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE |
| 摘要 |
A bonding resin that bonds substrates to each other in a state of being spaced with a gap between the substrates is configured by stacking a photosensitive resin and a bonding reinforcement resin which is different from the photosensitive resin, the photosensitive resin is patterned in one substrate, and the bonding reinforcement resin which is stacked on the patterned photosensitive resin has a fillet being a wet-spreading portion or a portion which swells outward from the photosensitive resin. |
| 申请公布号 |
US2016271951(A1) |
申请公布日期 |
2016.09.22 |
| 申请号 |
US201615060211 |
申请日期 |
2016.03.03 |
| 申请人 |
SEIKO EPSON CORPORATION |
发明人 |
SATO Naoya |
| 分类号 |
B41J2/16;B41J2/14 |
主分类号 |
B41J2/16 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electronic device where a first substrate and a second substrate are bonded to each other in a state of being spaced from each other with a gap by interposing a bonding resin between the first substrate and the second substrate,
wherein the bonding resin is configured by stacking a photosensitive resin and a bonding reinforcement resin which is different from the photosensitive resin, the photosensitive resin is patterned in at least one substrate of the first substrate and the second substrate, and the bonding reinforcement resin which is stacked on the patterned photosensitive resin, has a wet-spreading portion or a portion which swells outward from the photosensitive resin. |
| 地址 |
Tokyo JP |
