| 发明名称 |
Soldering method and solder joint |
| 摘要 |
Soldering method comprises placing a cadmium-zinc-lead solder on a copper base and exposing the solder joint to about 200 DEG C. for at least one hour to produce a copper-cadmium-zinc ternary interface barrier layer which inhibits migration.
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| 申请公布号 |
US4177916(A) |
申请公布日期 |
1979.12.11 |
| 申请号 |
US19780912894 |
申请日期 |
1978.06.05 |
| 申请人 |
HUGHES AIRCRAFT |
发明人 |
DENLINGER, MICHAEL C;KORB, ROBERT W;LARDENOIT, VERNON F |
| 分类号 |
B23K35/26;H05K3/34;(IPC1-7):B23K1/02 |
主分类号 |
B23K35/26 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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