发明名称 Array substrate and manufacturing method thereof, and display device
摘要 An array substrate and a manufacturing method thereof and a display device are provided, and the array substrate comprises: a substrate (1); a thin film transistor, a passivation layer (5) and a transparent electrode (6), sequentially formed on the substrate, wherein a groove (51) is formed in an upper surface of the passivation layer (5), and the transparent electrode (6) is provided in the groove (51).
申请公布号 US9465264(B2) 申请公布日期 2016.10.11
申请号 US201314362241 申请日期 2013.10.12
申请人 BOE Technology Group Co., Ltd. 发明人 Choi Seungjin;Yoo Seongyeol;Song Youngsuk
分类号 H01L21/77;H01L21/027;H01L27/12;G02F1/1333;G02F1/1343;G02F1/1362;G02F1/1368;H01L29/423;H01L29/49;H01L29/786;G03F7/00 主分类号 H01L21/77
代理机构 Collard & Roe, P.C. 代理人 Collard & Roe, P.C.
主权项 1. A manufacturing method of an array substrate, comprising: forming a thin film transistor and a passivation layer on a substrate, and the passivation layer covering the thin film transistor and being formed with a groove in a upper surface; and forming a transparent electrode in the groove; wherein the step of forming the groove in the upper surface of the passivation layer comprises: forming the passivation layer on the substrate with the thin film transistor formed thereon; coating a photoresist on the passivation layer, and exposing the photoresist through a double-tone mask, wherein the photoresist corresponding to a region where the transparent electrode is disposed is partly exposed, the photoresist corresponding to a region of a through hole exposing the drain electrode is completely exposed, and the photoresist in other regions is not exposed; after a developing treatment, removing the completely exposed photoresist so that the passivation layer corresponding to the region of the through hole exposing the drain electrode is exposed, and then forming the through hole exposing the drain electrode by using an etching process; removing the partly exposed photoresist by using an ashing process so that the passivation layer corresponding to the region of where the transparent electrode is disposed; and partly removing the exposed passivation layer by using an etching process, so that the groove is formed in an upper surface of the passivation layer.
地址 Beijing CN