| 摘要 |
In an arrangement wherein first and second elements (e.g. of copper) arranged on opposite sides of a substrate (e.g. electronically insulating) are provided with respective adjoining parts which are connected together by connecting means passing through a hole formed in the said substrate, the part (31a) of the first element (31) blocks the hole (35), (35) in the substrate (33), whilst the part (32a) of the second element (32) is fixed in solder (36) which at least partly fills the said hole and which forms the said connecting means (34). The solder may be introduced into the hole in paste form by screen printing and remelted by hot gas. An electrically heated bit may deform the second element part (32a) into the solder while melting the latter. <IMAGE> |
