| 发明名称 | Electronic device and manufacturing method thereof | ||
| 摘要 | A method for manufacturing an electronic device, the method comprising: providing a conducting wire; forming a mixture with the conducting wire buried therein, wherein the mixture comprises: a first magnetic powder and a second magnetic powder, wherein the mean particle diameter of the first magnetic powder is larger than the mean particle diameter of the second magnetic powder, and the Vicker's Hardness of the first magnetic powder is greater than the Vicker's Hardness of the second magnetic powder by a first hardness difference; and performing a molding process on the conducting wire and the mixture, wherein by means of the first hardness difference of the first magnetic powder and the second magnetic powder, the mixture and the conducting wire buried therein are combined to form an integral magnetic body at a temperature lower than the melting point of the conducting wire. | ||
| 申请公布号 | US9481037(B2) | 申请公布日期 | 2016.11.01 |
| 申请号 | US201414507849 | 申请日期 | 2014.10.07 |
| 申请人 | CYNTEC Co., Ltd. | 发明人 | Liao Wen-Hsiung;Hsieh Roger;Ikuta Hideo;Chen Yueh-Lang |
| 分类号 | B22F3/12;H01F27/24;H01F17/04;H01F27/255;H01F41/02;H01F27/28;H05K1/18;B22F5/00;B22F7/08;H01F1/22;H01F27/29 | 主分类号 | B22F3/12 |
| 代理机构 | Litron Patent & Trademark Office | 代理人 | Teng Min-Lee;Litron Patent & Trademark Office |
| 主权项 | 1. A method for manufacturing an electronic device, the method comprising: providing an insulated conducting wire; forming a mixture with the insulated conducting wire buried therein, wherein the mixture comprises: a first magnetic powder and a second magnetic powder, wherein the mean particle diameter of the first magnetic powder is larger than the mean particle diameter of the second magnetic powder, and the Vicker's Hardness of the first magnetic powder is greater than the Vicker's Hardness of the second magnetic powder by a first hardness difference; and performing a molding process on the insulated conducting wire and the mixture, wherein by means of the first hardness difference of the first magnetic powder and the second magnetic powder, the mixture and the insulated conducting wire buried therein are combined to form an integral magnetic body at a temperature lower than the melting point of the insulated conducting wire. | ||
| 地址 | Hsinchu TW | ||