| 摘要 |
Two-point diagonally opposite electrical connection between the surface area forming a lead-receiving hole of one electrical device and the corresponding resilient lead of another electrical device is maintained by an eccentric pin inserted into holes in the two devices. An electrically conductive spring for interconnecting lead lines on a printed circuit board comprises a resilient main body for insertion into a hole in the printed circuit board, retaining protrusions integral with the main body for keeping it in the hole, and resilient arms extending outward from the main body for contacting selected lead lines. An electrical cord is anchored to a stiff sheet using a cantilevered door continuous with the sheet, the door opening having a notch for receiving the cord and, in association with the door, for holding the cord as it passes through the door opening.
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