POLYAMIDE ACID COMPOSITION, POLYIMIDE, RESIN FILM, AND METAL-CLAD LAMINATE

摘要

PROBLEM TO BE SOLVED: To provide polyimide which can cope with a higher frequency in association with miniaturization/higher performance of an electronic apparatus and is excellent in dimensional stability and flame retardancy, and to provide a resin film and a metal-clad laminate.SOLUTION: A polyamide acid composition contains (A) a polyamide acid in which a diamine component contains an aromatic diamine and a dimer acid type diamine prepared by substituting a primary aminomethyl group or an amino group for two terminal carboxylic acid groups of a dimer acid, and the dimer acid type diamine is contained by 3 mol% or more and 8 mol% or less with respect to the whole diamine component; and (B) a compound containing a phosphorus atom in the molecule. A weight ratio {dimer acid type diamine in (B) component/(A) component} of the (B) component to the dimer acid type diamine in the (A) component is in a range of 0.2-4.0.SELECTED DRAWING: None