| 摘要 |
An electronic apparatus cabinet assembly comprises a generally U-shaped extrusion having an interior mounting rail disposed near an open end thereof and a deck member secured between the legs of the extrusion. An RFI sealing material is disposed overlying the mounting rail which receives a lid member having dimensions slightly smaller than the open end of the extrusion. Upon forcing the lid member into compression against the sealing material and mounting rail, some of the sealing material is forced upward from the interstice between the lid member and the extrusion forming a joint having a high integrity RFI seal.
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