发明名称 Interpenetrating dual cure resin compositions
摘要 Curable resin compositions are prepared containing a radiation-sensitive reactive diluent and a saturated polyol. Curing is accomplished by mixing the reactive diluent and the polyol with a polyisocyanate, followed by exposure of the resultant composition to radiation to polymerize the reactive diluent and then, by thermal curing, to form the hydroxyisocyanate (urethane) linkage. The fully cured resin composition is described as interpenetrated or one in which there is no cross-linking between the reactive diluent and urethane linked co-polymer. The interpenetrated resin compositions form tough and hard coatings on various substrates.
申请公布号 US4247578(A) 申请公布日期 1981.01.27
申请号 US19780945373 申请日期 1978.09.25
申请人 HENKEL CORPORATION 发明人 SKINNER, EARL;EMEOTT, MARVIN;JEVNE, ALLAN
分类号 C08F283/00;C08F291/08;C08G18/63;(IPC1-7):C08L75/06 主分类号 C08F283/00
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