| 摘要 |
Provided is a filter device, which has a package-on-package (POP) structure, and enables out-of-band attenuation to increase. On a first electronic component unit 11, wherein a first electronic component element 13 is mounted on a first substrate 12, and a first sealing resin layer 18 is provided, a second electronic component unit 21, wherein a filter element 23 is provided on a second substrate 22, is laminated. In the filter device 1, a plurality of terminals connected to a ground potential, said terminals being among a plurality of terminals of the filter element 23, are commonly connected at positions further toward the first electronic component unit 11 side than a third main surface 22a of the second substrate 22. |
