发明名称 |
Intelligent soldering cartridge for automatic soldering connection validation |
摘要 |
An intelligent soldering cartridge that includes: a housing; a solder tip; a heater for heating the solder tip; a storage device for storing information about characteristics of the cartridge; a processor for retrieving the information about characteristics of the cartridge, monitoring the power level delivered to the solder tip to detect liquidus occurrence at a solder joint, determining a thickness of an intermetallic compound (IMC) of the solder joint using some of the retrieved information, determining whether the thickness of the IMC is within a predetermined range, and generating an indication signal indicating that a reliable solder joint connection is formed when the thickness of the IMC is within the predetermined range; and an interface for transmitting the indication signal. |
申请公布号 |
US9511439(B2) |
申请公布日期 |
2016.12.06 |
申请号 |
US201615096035 |
申请日期 |
2016.04.11 |
申请人 |
OK INTERNATIONAL INC. |
发明人 |
Marino Kenneth D.;Nguyen Hoa |
分类号 |
B23K31/00;B23K31/02;B23K3/06;B23K1/00;B23K3/03;B23K3/02;B23K3/08 |
主分类号 |
B23K31/00 |
代理机构 |
Lewis Roca Rothgerber Christie LLP |
代理人 |
Lewis Roca Rothgerber Christie LLP |
主权项 |
1. An intelligent soldering cartridge comprising:
a housing; a solder tip; a heater for heating the solder tip; a processor for determining a thickness of an intermetallic compound (IMC) of a solder joint being formed by the solder tip, and generating an indication signal indicating that a reliable solder joint connection is formed when the thickness of the IMC is within a predetermined range; and an interface for transmitting the indication signal. |
地址 |
Cypress CA US |