发明名称 Intelligent soldering cartridge for automatic soldering connection validation
摘要 An intelligent soldering cartridge that includes: a housing; a solder tip; a heater for heating the solder tip; a storage device for storing information about characteristics of the cartridge; a processor for retrieving the information about characteristics of the cartridge, monitoring the power level delivered to the solder tip to detect liquidus occurrence at a solder joint, determining a thickness of an intermetallic compound (IMC) of the solder joint using some of the retrieved information, determining whether the thickness of the IMC is within a predetermined range, and generating an indication signal indicating that a reliable solder joint connection is formed when the thickness of the IMC is within the predetermined range; and an interface for transmitting the indication signal.
申请公布号 US9511439(B2) 申请公布日期 2016.12.06
申请号 US201615096035 申请日期 2016.04.11
申请人 OK INTERNATIONAL INC. 发明人 Marino Kenneth D.;Nguyen Hoa
分类号 B23K31/00;B23K31/02;B23K3/06;B23K1/00;B23K3/03;B23K3/02;B23K3/08 主分类号 B23K31/00
代理机构 Lewis Roca Rothgerber Christie LLP 代理人 Lewis Roca Rothgerber Christie LLP
主权项 1. An intelligent soldering cartridge comprising: a housing; a solder tip; a heater for heating the solder tip; a processor for determining a thickness of an intermetallic compound (IMC) of a solder joint being formed by the solder tip, and generating an indication signal indicating that a reliable solder joint connection is formed when the thickness of the IMC is within a predetermined range; and an interface for transmitting the indication signal.
地址 Cypress CA US