METHOD FOR MANUFACTURING TRUER AND METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER, AND CHAMFERING DEVICE FOR SEMICONDUCTOR WAFER

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a truer having a shape controlled with a high accuracy.SOLUTION: A method for manufacturing a truer which grinds and forms a peripheral edge part of a disk-like plate 10 in which abrasive grains are hardened by use of a cylindrical grind stone 20. The method is characterized that the disk-like plate 10 and the grind stone 20 are rotated in respective circumferential directions and one or both of the plate 10 and the grind stone 20 is moved so as to bring peripheral surfaces of the plate 10 and the grind stone 20 into contact with each other thereby grinding and forming the peripheral edge part of the plate 10 into a target shape.SELECTED DRAWING: Figure 4