发明名称 |
Method for the electroless deposition of palladium |
摘要 |
A bath for the electroless deposition of palladium comprises an aqueous solution of divalent palladium, ammonia or amine, and a tertiary amine borane. The bath may contain thio-organic, iminonitrile or other stabilizers. A hard palladium alloy is plated, having the composition of 1-3% amorphous borone, 1-3% crystalline PdH0.706, the remainder amorphous palladium. A strong laminate is formed when the alloy is plated on electroless nickel.
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申请公布号 |
US4279951(A) |
申请公布日期 |
1981.07.21 |
申请号 |
US19800165479 |
申请日期 |
1980.07.03 |
申请人 |
MINE SAFETY APPLIANCES COMPANY |
发明人 |
HOUGH, WILLIAM V.;LITTLE, JOHN L.;WARHEIT, KEVIN E. |
分类号 |
C23C18/44;(IPC1-7):C23C3/02 |
主分类号 |
C23C18/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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