发明名称 Method for the electroless deposition of palladium
摘要 A bath for the electroless deposition of palladium comprises an aqueous solution of divalent palladium, ammonia or amine, and a tertiary amine borane. The bath may contain thio-organic, iminonitrile or other stabilizers. A hard palladium alloy is plated, having the composition of 1-3% amorphous borone, 1-3% crystalline PdH0.706, the remainder amorphous palladium. A strong laminate is formed when the alloy is plated on electroless nickel.
申请公布号 US4279951(A) 申请公布日期 1981.07.21
申请号 US19800165479 申请日期 1980.07.03
申请人 MINE SAFETY APPLIANCES COMPANY 发明人 HOUGH, WILLIAM V.;LITTLE, JOHN L.;WARHEIT, KEVIN E.
分类号 C23C18/44;(IPC1-7):C23C3/02 主分类号 C23C18/44
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