Process for partially electroplating flat silver

摘要

A process for partially silver electroplating the metal surface of a flat silver part wherein part of the surface is covered prior to silvering with a plating-resistant dipping enamel. A separation surface is provided between the exposed surface of the part to be covered with the dipping enamel and the exposed surface of the lengthwise adjacent part to be silvered. The separation surface consists of a material which is more difficult to wet with the dipping enamel than the metal of the surface to be covered. Preferably, the separation surface is the peripheral surface of a spacer lamination composed of polytetrafluoroethylene.