发明名称 |
METHOD AND DEVICE FOR MANUFACTURING AN INTERMEDIATE MOUNTING ELEMENT FOR SEMICONDUCTOR CHIPS |
摘要 |
<p>A method of fabricating a semiconductor device mounting element embodying a wire fan-out wherein the ends of a plurality of insulated wires are supported in a spatial parallel arrangement of columns and rows between two spaced apertured die elements, the spacing of the wires is reduced at a first location between the die elements while maintaining the spatial arrangement of columns and rows, forming an enclosure about the wire portions positioned adjacent one of the die elements and the location where the spacing of the wires is reduced, injecting an organic hardenable resin material into the enclosure thereby encapsulating the wires positioned within, severing the wires, and removing the die.</p> |
申请公布号 |
EP0004556(B1) |
申请公布日期 |
1981.11.04 |
申请号 |
EP19790100622 |
申请日期 |
1979.03.02 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BERNARDO, EDWARD THOMAS;FAURE, LOUIS HENRY;JOHNSON, ALFRED HAROLD;PITTWOOD, DONALD GLEN |
分类号 |
H01L23/50;H01L21/48;H01L23/14;H01L23/538;(IPC1-7):01L21/48;01L23/14 |
主分类号 |
H01L23/50 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|