Partial encapsulation of circuits with integral terminals tabs - by dipping same tabs into silicone rubber for temporary cover

摘要

Encapsulation in resin (I) of the body of an electronic circuit having terminal tabs at each end is preceded by dip coating the tabs at one end in an impermeable coating (II), then encapsulating the circuit and the protected tabs in resin (I) by another dip coating treatment, the unprotected tabs remaining clear of the latter treatment. The double coating is locally removed to reexpose the tabs which had been protected. Process is more versatile and involves less expensive equipment than processes in which the tabs are washed by a close-fitting mould into which the encapsulating resin (I) alone is used.