Sintered multi-layer ceramic substrate and method of making same.

摘要

The MLC substrate (10) is formed of a plurality of ceramic green sheets that are provided with metallurgy patterns and/or metal filled vias laminated together and sintered. The top sheet (40) thickness is at least 20 % greater than the individual thickness of the underlying sheets (21, 23, 25). At least part of the vias (30, 34) in said top sheet (40) form a pattern of vias (30) having a center-to-center spacing of 178 to 305 um, with the via diameter being in the range of 35 to 55 % of the center-center via spacing. The MLC substrate (10) in which cracks especially between closely spaced metal filled vias (30) are minimized or eliminated can be used to interconnect LSI circuit chips mounted on top of it.