发明名称 |
Formation of an electrode pattern |
摘要 |
A method is disclosed for forming an electrode pattern which is free of erosion, separation of a wiring pattern from a substrate, etc., through the use of a lift-up method, which comprises the steps of: etching a transparent, electrically conductive film deposited on a major surface of the substrate for the formation of the transparent electrode pattern; overlaying the whole of the major surface of the substrate with a layer of photoresist; removing a portion of said photoresist layer in the metal electrode pattern; coating substantially the entire major surface of the substrate with a layer of metal electrode material; and removing the remaining photoresist layer with the aid of a resist remover thereby forming the metal electrode pattern.
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申请公布号 |
US4326929(A) |
申请公布日期 |
1982.04.27 |
申请号 |
US19790081439 |
申请日期 |
1979.10.03 |
申请人 |
SHARP KABUSHIKI KAISHA |
发明人 |
MINEZAKI, SHIGEHIRO;TAKAMATSU, TOSHIAKI;KOZAKI, SHUICHI |
分类号 |
H01L21/30;G02F1/1343;G03F7/00;G09F9/30;H01B13/00;H01L21/027;H01L31/18;H05K3/24;(IPC1-7):C25D11/02;B05D5/00;B05D5/12 |
主分类号 |
H01L21/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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