发明名称 Formation of an electrode pattern
摘要 A method is disclosed for forming an electrode pattern which is free of erosion, separation of a wiring pattern from a substrate, etc., through the use of a lift-up method, which comprises the steps of: etching a transparent, electrically conductive film deposited on a major surface of the substrate for the formation of the transparent electrode pattern; overlaying the whole of the major surface of the substrate with a layer of photoresist; removing a portion of said photoresist layer in the metal electrode pattern; coating substantially the entire major surface of the substrate with a layer of metal electrode material; and removing the remaining photoresist layer with the aid of a resist remover thereby forming the metal electrode pattern.
申请公布号 US4326929(A) 申请公布日期 1982.04.27
申请号 US19790081439 申请日期 1979.10.03
申请人 SHARP KABUSHIKI KAISHA 发明人 MINEZAKI, SHIGEHIRO;TAKAMATSU, TOSHIAKI;KOZAKI, SHUICHI
分类号 H01L21/30;G02F1/1343;G03F7/00;G09F9/30;H01B13/00;H01L21/027;H01L31/18;H05K3/24;(IPC1-7):C25D11/02;B05D5/00;B05D5/12 主分类号 H01L21/30
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