发明名称 FILM MATERIAL AND ELECTRONIC COMPONENT USING THE SAME, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a film material having high heat resistance and excellent transferability.SOLUTION: There is provided a film material which has a base material 1 and a film layer 2 disposed on one main surface of the base material 1, where the film layer 2 contains a first fibrous resin and a second thermosetting resin 2R in an uncured or semi-cured state, a softening start temperature ST1 of the first resin is higher than a softening start temperature ST2 of the second resin in the uncured or semi-cured state, and when a thickness of the film layer 2 is represented by T, a volume ratio VF1of a fiber 2F from the surface on the base material 1 side of the film layer 2 to the region of 0.5T is larger than a volume ratio VF2of the fiber 2F from the other surface in the film layer 2 to a region of 0.5T.SELECTED DRAWING: Figure 1A
申请公布号 JP2016182698(A) 申请公布日期 2016.10.20
申请号 JP20150063422 申请日期 2015.03.25
申请人 PANASONIC IP MANAGEMENT CORP 发明人 MOTOMURA KOJI
分类号 B32B5/28;H01L21/60;H05K1/18;H05K3/32 主分类号 B32B5/28
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