Multi-layer printed circuit board and process for production thereof.

摘要

A multi-layer printed circuit board produced by laminating a plurality of unit circuit sheets via prepreg resin sheets, the cured resin in said unit circuit sheet having a glass transition temperature Tg<Sub>1</Sub>, said prepreg resin sheets having been prepared by impregnating a reinforcing substrate with a resin composition which can be cured at a temperature equal to or lower than both the glass transition temperature of Tg, and that of T<Sub>92</Sub> of the resin in the prepreg resin sheet after cured, and binding the laminated sheets with heating under pressure at a temperature equal to or lower than both the temperatures of Tg, and Tg<Sub>2</Sub>, has excellent dimensional stability, heat resistance and through-hole reliability.