| 摘要 |
A method for producing a circuit module in the form of a board, which circuit module, after its production, contains a carrier (T) which is in the form of a board, internal connections (IA) (which are printed on the correspondingly prepared carrier (T) using solder paste and melt if the melting temperature is exceeded) of leads (L) (for example of leads (L) which are printed over their entire length between their external connection (AA) and internal connection (IA) by means of screen printing using solder paste) and at least one integrated semiconductor circuit body (H) ("chip") which remains without a housing having supply tongues (I) which, for their part, have initially been laid on the internal connections (IA), and, thereafter, have been permanently conductively connected to the internal connections (IA) while they (IA) are melting, the supply tongues (I) not yet themselves being completely melted at this temperature. In the following steps, a) the supply tongues (I) are placed, such that they touch them or sink into them, onto the internal connections (IA) which are printed on the carrier (T) by means of solder paste, are still moist and are more or less sticky, b) the internal connection (IA), especially not until much later after drying of the solder paste, are temporarily melted without any contact pressure in a furnace, specifically without pressing these supply tongues (I) onto the internal connections (IA), which are melted in this case, by means of a hot stamp (I) or bracket, the surface tension of the solder paste pulling the chip into its correct position, even if the chip has been positioned only inaccurately in the event of a broad adjustment tolerance in step a). <IMAGE>
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