Bondable insulating plate

摘要

The invention is an insulating plate capable of being bonded to a substrate comprising a highly disperse inorganic heat-insulating material and a binder, the binder being inhomogeneously distributed in such a manner that in the region near the bonding surface, the content of binder is from 3 to 15% by weight, and, in the remaining region, it is from about 0 to 1.5% by weight. The plate according to the invention may be in the form of a cooking plate.